Seminar: “Optimizing processing and technology packaging: Improve production efficiency and reduce environmental impact”


Date: 10/11/2023

Time: 09:00 – 15:30

Venue: SECC, District 7, TP.HCM




In the context of increasingly acrimonious competition, manufacturing and mechanical engineering companies need to seek effective solutions to optimize production processes and increase productivity. With the rapid development of Artificial Intelligence (AI) and Deep Learning (DL), these technologies are becoming an important part of production processes. With the theme of “AI/IoT/Deep Learning Application Trends For Work Efficiency Optimization And Cost Saving In Manufacturing Industry”, we believes that we will provide companies with the necessary knowledge to better understand the potential of AI/Deep Learning in manufacturing and mechanical engineering and assisting them in applying them to their manufacturing processes.


Time Content Speaker
09h00 – 09h20 Check-in
09h20 – 09h30 Opening
09h30 – 10h40 Digitization and the application of anti-counterfeiting technology in packaging manufacturing: Enhancing efficiency and cost savings, safeguarding brand integrity, and protecting consumer rights Mr. Nguyen Viet Hong

Chairman of directors, CEO Vina CHG

10h40 – 11h20 Connecting Packaging Information and Customer Engagement: QR and NFC Technology in Management and Traceability Mr. Tran Duc Phong

Head of Department Marketing Mirraway

11h20 – 13h30 Lunch break
13h30 – 14h10 Emerging Trends in Packaging Design: Color, Imagery, and the Application of AR/VR Technology Ms. Ha Phan Kim Nguyet

Founder UPGREEN Viet Nam

14h10 – 14h50 Automated Packaging Solutions in Manufacturing Mr. Nguyen Trong Thuong

CEO ETEK Automation Solution

14h50 – 15h00 Closing and gift presentation


Ms. Donna Ha

T: 028 3622 2588 (ext. 161)

E: [email protected]



ProPak Vietnam