Seminar: “Optimizing processing and technology packaging: Improve production efficiency and reduce environmental impact”
Date: 10/11/2023
Time: 09:00 – 15:30
Venue: SECC, District 7, TP.HCM
Organizers:
In the context of increasingly acrimonious competition, manufacturing and mechanical engineering companies need to seek effective solutions to optimize production processes and increase productivity. With the rapid development of Artificial Intelligence (AI) and Deep Learning (DL), these technologies are becoming an important part of production processes. With the theme of “AI/IoT/Deep Learning Application Trends For Work Efficiency Optimization And Cost Saving In Manufacturing Industry”, we believes that we will provide companies with the necessary knowledge to better understand the potential of AI/Deep Learning in manufacturing and mechanical engineering and assisting them in applying them to their manufacturing processes.
AGENDA
| Time | Content | Speaker |
| 09h00 – 09h20 | Check-in | |
| 09h20 – 09h30 | Opening | |
| 09h30 – 10h40 | Digitization and the application of anti-counterfeiting technology in packaging manufacturing: Enhancing efficiency and cost savings, safeguarding brand integrity, and protecting consumer rights | Mr. Nguyen Viet Hong
Chairman of directors, CEO Vina CHG |
| 10h40 – 11h20 | Connecting Packaging Information and Customer Engagement: QR and NFC Technology in Management and Traceability | Mr. Tran Duc Phong
Head of Department Marketing Mirraway |
| 11h20 – 13h30 | Lunch break | |
| 13h30 – 14h10 | Emerging Trends in Packaging Design: Color, Imagery, and the Application of AR/VR Technology | Ms. Ha Phan Kim Nguyet
Founder UPGREEN Viet Nam |
| 14h10 – 14h50 | Automated Packaging Solutions in Manufacturing | Mr. Nguyen Trong Thuong
CEO ETEK Automation Solution |
| 14h50 – 15h00 | Closing and gift presentation |
CONTACT US:
Ms. Donna Ha
T: 028 3622 2588 (ext. 161)
